Practical tips for Android smartphone users to maximize the lifespan of silicon-carbon (Si/C) battery

SEI — Solid Electrolyte Interphase What it is The SEI is a thin passivation film that forms on the anode the first time the cell is charged, and that keeps growing or repairing over the pack’s life. Without a stable SEI, the electrolyte would keep reacting with the anode until the cell was dead. With… Read More Practical tips for Android smartphone users to maximize the lifespan of silicon-carbon (Si/C) battery

Fourth-Generation GaN Technology: Advancements, Platforms, and Applications

Fourth-generation gallium nitride (GaN) technology refers primarily to the latest commercial power semiconductor platforms from leading GaN device makers (roughly 2023–2025 timeframe), which deliver meaningful gains in figures of merit (FOMs), efficiency, power density, reliability, and system integration over prior generations. These are evolutionary refinements of GaN high-electron-mobility transistors (HEMTs)—typically lateral GaN-on-silicon enhancement-mode or depletion-mode… Read More Fourth-Generation GaN Technology: Advancements, Platforms, and Applications

Third-generation gallium nitride (GaN) technology explained: Device Architectures, Evolution, and Applications from Consumer Chargers

Third-generation gallium nitride (GaN) technology refers primarily to GaN as a wide-bandgap (WBG) semiconductor material belonging to the third generation of semiconductors, with secondary references to successive generations of commercial GaN devices and processes. Semiconductor Generations and GaN’s Place Semiconductor materials are conventionally grouped by bandgap and performance envelope: GaN is a binary III-V compound… Read More Third-generation gallium nitride (GaN) technology explained: Device Architectures, Evolution, and Applications from Consumer Chargers

Second-generation GaN technology: A guide to Advances, Device Architecture, and Real-World Applications

Second-generation GaN technology generally refers to improved commercial generations of gallium nitride power devices (primarily lateral high-electron-mobility transistors, or HEMTs) that deliver lower on-resistance, better packaging, reduced parasitics, higher reliability, and improved dynamic performance over early commercial offerings—while the broader field continues advancing toward multi-channel structures, higher voltages, integration, and vertical GaN-on-GaN architectures. Fundamentals of… Read More Second-generation GaN technology: A guide to Advances, Device Architecture, and Real-World Applications

First-generation gallium nitride (GaN) technology Explained

First-generation gallium nitride (GaN) technology refers primarily to the earliest commercial and near-commercial high-electron-mobility transistors (HEMTs) and related devices that emerged in the mid-2000s, building on foundational material and device breakthroughs from the 1960s–1990s. These early devices leveraged GaN’s wide-bandgap properties for high-power, high-frequency RF applications and later power switching, typically in depletion-mode (normally-on) configurations… Read More First-generation gallium nitride (GaN) technology Explained

Universal Flash Storage (UFS) 4.1: A Deep Dive – Features, Performance, Power Efficiency, Reliability, Security, and Applications

Universal Flash Storage (UFS) 4.1 is the latest iteration of the JEDEC standard for high-performance, low-power embedded flash storage, primarily targeted at smartphones, tablets, automotive systems, IoT devices, and edge AI applications. JEDEC officially published the UFS 4.1 specification (JESD220G) and the complementary UFS Host Controller Interface (UFSHCI) 4.1 (JESD223F) on January 8, 2025. UFS… Read More Universal Flash Storage (UFS) 4.1: A Deep Dive – Features, Performance, Power Efficiency, Reliability, Security, and Applications